Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
374324B00035G
374324B00035G

374324B00035G

DigiKey Part Number
HS318-ND
Manufacturer
Manufacturer Product Number
374324B00035G
Description
HEATSINK BGA W/ADHESIVE TAPE
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
Datasheet
 Datasheet
Product Attributes
Filter Similar Products
Show Empty Attributes
Category
Length
1.063" (27.00mm)
Mfr
Width
1.063" (27.00mm)
Series
Fin Height
0.394" (10.00mm)
Packaging
Box
Power Dissipation @ Temperature Rise
3.0W @ 90°C
Part Status
Active
Thermal Resistance @ Forced Air Flow
9.30°C/W @ 200 LFM
Type
Board Level
Thermal Resistance @ Natural
30.60°C/W
Package Cooled
Material
Attachment Method
Thermal Tape, Adhesive (Included)
Material Finish
Black Anodized
Shape
Square, Pin Fins
Base Product Number
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 2,453
Check for Additional Incoming Stock
Non-Cancelable/Non-Returnable
All prices are in EUR
Box
QuantityUnit PriceExt Price
1€2.25000€2.25
10€1.99100€19.91
25€1.89680€47.42
50€1.82840€91.42
100€1.76230€176.23
250€1.67848€419.62
756€1.58254€1,196.40
1,512€1.52518€2,306.07
5,292€1.42656€7,549.36
Manufacturers Standard Package
Unit Price without VAT:€2.25000
Unit Price with VAT:€2.74500