EMA Design Automation’s OrCAD bundle creates reliable PCB designs with the intuitive design interface of OrCAD capture with UltraBOM powered by Digi-Key.

Chip Quik's liquid flux is available in 10 ml (0.34 oz) pen, 15 ml (0.5 oz) squeeze bottle, and 30 ml (1.0 oz) squeeze bottle.

Bourns' IsoMOV™ protection component combines the surge performance of EdgMOV™ protection devices with an integrated gas discharge tube isolation structure.

Klein Tools’ multimeters are designed to quickly measure voltage, current, and resistance with ease and are built to withstand job site conditions.

Adam Tech's high-speed mini FAKRA connectors and cable assemblies support data transmission rates up to 20 Gbps and frequencies up to 9 GHz.

TE Connectivity's (TE) DT-XT connectors feature innovative, high-performance sealing technology for all commercial vehicle applications in harsh conditions.

TE's M12 over-molded X-code cordsets contain male straight- and right-angle versions that transmit data rates up to 10 Gb/s according to IEC 61076-2-109.

Diodes' PI2DBS16212A mux/demux supports data rates up to 20 Gbps and is available in a 2.5 mm x 2.5 mm W-QFN25252-24 package.

TRINAMIC’s 3-Phase MOSFET gate driver maximizes battery life and cuts component count in half.

Littelfuse’s MDB series power distribution module can be configured with two or three MIDI fuses.

This highly reliable array of low profile, nickel-plated phosphor bronze retainers from MPD secures a wide range of coin cells.

Littelfuse's sensitive gate SCR series offers high static dv/dt with low turn off time (tq) through small die planar construction design.

C&K's ZMV series mini snap-acting switches have an internal spring design return that ensures the actuator is restored to the same position every time.

STMicroelectronics' VD6283 is a color sensor with advanced light flicker extraction. Light measurement is fast and accurate, thanks to an individual ADC.

Amphenol FCI's Minitek® Multipitch 1.25 mm and 1.50 mm wire-to-board connector's compact design addresses the growing demand for miniaturizing components.