Power Driver Modules

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of 9

Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Configuration	Current	Voltage	Voltage - Isolation	Mounting Type	Package / Case
MSCSM120DAM11CT3AG MOSFET IPM 1.2KV 254A MODULE Microchip Technology	4 In Stock	1 : €155.44000 Tube	-	Tube	Active	MOSFET	1 Phase	254 A	1.2 kV	4000Vrms	Chassis Mount	Module
MSCSM120SKM11CT3AG MOSFET IPM 1.2KV 254A MODULE Microchip Technology	4 In Stock	1 : €155.44000 Tube	-	Tube	Active	MOSFET	1 Phase	254 A	1.2 kV	4000Vrms	Chassis Mount	Module
MSCSM70TAM05TPAG MOSFET IPM 700V 273A MODULE Microchip Technology	1 In Stock	1 : €524.06000 Tube	-	Tube	Active	MOSFET	3 Phase Inverter	273 A	700 V	-	Chassis Mount	Module
APTLGF350A608G IGBT IPM 600V 430A 6-PWRSIP MOD Microchip Technology	0 In Stock	50 : €194.97140 Bulk	-	Bulk	Obsolete	IGBT	Half Bridge	430 A	600 V	2500Vrms	Through Hole	6-PowerSIP Module
APTLGT400A608G IGBT IPM 600V 600A 6-PWRSIP MOD Microchip Technology	0 In Stock Check Lead Time	3 : €290.86000 Bulk	-	Bulk	Active	IGBT	Half Bridge	600 A	600 V	2500Vrms	Through Hole	6-PowerSIP Module
APTLGL325A1208G IGBT IPM 1.2KV 420A 6-PWRSIP MOD Microchip Technology	0 In Stock Check Lead Time	3 : €326.51333 Bulk	-	Bulk	Active	IGBT	Half Bridge	420 A	1.2 kV	2500Vrms	Through Hole	6-PowerSIP Module
APTLGT300A1208G IGBT IPM 1.2KV 440A 6-PWRSIP MOD Microchip Technology	0 In Stock Check Lead Time	3 : €334.47667 Bulk	-	Bulk	Active	IGBT	Half Bridge	440 A	1.2 kV	2500Vrms	Through Hole	6-PowerSIP Module
MSCSM70XM19CTYZBNMG MOSFET IPM 650V 110A MODULE Microchip Technology	0 In Stock Check Lead Time	1 : €674.27000 Tube	-	Tube	Active	MOSFET	3 Phase	110 A	650 V	4000Vrms	Chassis Mount	Module
MSCSM120XM31CTYZBNMG MOSFET IPM 1.2KV 80A MODULE Microchip Technology	0 In Stock Check Lead Time	1 : €701.05000 Tube	-	Tube	Active	MOSFET	3 Phase	80 A	1.2 kV	4000Vrms	Chassis Mount	Module

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Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.